HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 227

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

7.1.2
Figure 7.1 shows a DMAC block diagram.
Internal
interrupts
Interrupt
signals
Legend
DTCR:
MAR:
IOAR:
ETCR:
Rev. 2.0, 06/04, page 198 of 980
Data transfer control register
Memory address register
I/O address register
Execute transfer count register
DEND0A
DEND0B
DEND1A
DEND1B
Block Diagram
DREQ
DREQ
TEND
TEND
IMIA0
IMIA1
IMIA2
RXI0
TXI0
ADI
Data buffer
0
1
0
1
Control logic
Figure 7.1 Block Diagram of DMAC
DTCR0A
DTCR0B
DTCR1A
DTCR1B
Internal address bus
Internal data bus
Channel
Channel
0
1
Channel
Channel
Channel
Channel
0A
0B
1A
1B
Arithmetic-logic unit
Address buffer
MAR0A
MAR0B
MAR1A
MAR1B
ETCR0A
ETCR0B
ETCR1A
ETCR1B
IOAR0A
IOAR0B
IOAR1A
IOAR1B