HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 196

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

(
When RAS down mode is selected, the conditions for an asserted RASn signal to return to the
high level are as shown below. The timing in these cases is shown in figure 6.24.
Note: n = 2 to 5
PB
When DRAM space with a different row address is accessed
Immediately before a CAS-before-RAS refresh cycle
When the BE bit or RDM bit is cleared to 0 in DRCRA
Immediately before release of the external bus
D
4
A
Figure 6.23 Example of Operation Timing in RAS Down Mode (CSEL = 0)
/PB
/
15
23
(
to D
to A
5
)
0
0
)
T
p
DRAM access
Tr
T
c1
T
c2
External space
T
1
access
Rev. 2.0, 06/04, page 167 of 980
T
2
DRAM access
T
c1
T
c2