HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 423

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Rev. 2.0, 06/04, page 394 of 980
C
U
C
U
C
U
P
P
P
Internal data bus
Internal data bus
Internal data bus
Figure 10.5 8TCNT1 Access Operation (CPU Writes to 8TCNT1, Lower Byte)
Figure 10.7 8TCNT1 Access Operation (CPU Reads 8TCNT1, Lower Byte)
Figure 10.6 8TCNT0 Access Operation (CPU Reads 8TCNT0, Upper Byte)
H
H
H
L
L
L
Bus
interface
Bus
interface
Bus
interface
8TCNTH0 8TCNTL1
8TCNT0 8TCNT1
8TCNT0 8TCNT1
H
H
H
L
L
L
Module data bus
Module data bus
Module data bus