HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 178

MCU 5V 512K,PB-FREE 100-TQFP

HD64F3029XBL25V

Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3029XBL25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
8-Bit, Two-State-Access Areas
Figure 6.10 shows the timing of bus control signals for an 8-bit, two-state-access area. The upper
data bus (D
cannot be inserted.
Figure 6.10 Bus Control Signal Timing for 8-Bit, Two-State-Access Area
15
to D
Write access
Read access
8
) is used in accesses to these areas. The LWR pin is always high. Wait states
Note: n = 7 to 0
Address bus
D
D
D
D
15
15
7
7
to D
to D
to D
to D
n
0
0
8
8
External address in area n
High
T
1
Bus cycle
Undetermined data
Valid
Rev. 2.0, 06/04, page 149 of 980
Invalid
T
Valid
2

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