HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 796

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Note: * Specification from the earliest negation timing of RAS and CAS.
A
CS
(RAS
UCAS, LCAS
(read)
RD (WE)
(read)
D
(read)
UCAS, LCAS
(write)
RD (WE)
(write)
D
(write)
RFSH
23
15
15
5
to A
to D
to D
to CS
5
to RAS
0
0
0
2
2
)
t
AD
High
T
p
Figure 21.19 DRAM Bus Timing (Read/Write)
High
t
RP
t
AD
t
AS1
T
t
RAD1
r
t
RAH
t
RAC
t
AD
t
AA
T
C1
t
t
ASD
WDD
t
ASD
t
CAC
t
t
WDS
WCS
t
CASD1
t
CAS1
Rev. 2.0, 06/04, page 767 of 980
t
WCH
T
C2
t
t
RDS
t
WCD
CAS2
t
WDH
t
t
RAD2
CASD2
t
t
RDH*
CASD2
t
t
CP
CP