HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 996

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Mode 7: Figure D.4 is a timing diagram for the case in which RES goes low during an operation
in mode 7. As soon as RES goes low, all ports and clock pin P6
P6
Internal reset
signal
A
(read)
(write)
D
(write)
I/O port,
P6
4-5
Internal reset
signal
I/O port
23
15
7
,
7
7
/
to A
to D
/
to
,
0
0
1
Figure D.3 Reset during Memory Access (Mode 5)
Figure D.4 Reset during Operation (Mode 7)
Access to external
T1
memory
T2
T3
7
/ are initialized to the input state.
Rev. 2.0, 06/04, page 967 of 980
High impedance
High impedance
High impedance
High impedance
High impedance