HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 755

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

21.1.5
Table 21.9 lists the D/A conversion characteristics.
Table 21.9 D/A Conversion Characteristics
Conditions: T
Item
Resolution
Conversion time
(centering time)
Absolute accuracy*
Note:
Rev. 2.0, 06/04, page 726 of 980
* Except in software standby mode.
D/A Conversion Characteristics
V
fmax = 25 MHz
a
CC
= –20°C to +75°C (Regular specifications),
= 3.0 V to 3.6 V, AV
Min
8
—
—
—
Typ
8
—
±2.0
—
CC
= 3.0 V to 3.6 V, V
Max
8
10
±3.0
±2.0
REF
= 3.0 V to AV
Unit
bits
µs
LSB
LSB
CC
, V
Test Conditions
20 pF capacitive
load
2 M
load
4 M
load
SS
= AV
resistive
resistive
SS
= 0 V,