HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 28

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

20.5 Hardware Standby Mode .................................................................................................. 708
20.6 Module Standby Function................................................................................................. 710
20.7 System Clock Output Disabling Function......................................................................... 711
Section 21 Electrical Characteristics..................................................................713
21.1 Electrical Characteristics of HD64F3029F25 and HD64F3029TE25............................... 713
21.2 Electrical Characteristics of HD64F3029F25W and HD64F3029TE25W ....................... 728
21.3 Electrical Characteristics of HD64F3029FBL25 and HD64F3029TEBL25..................... 743
21.4 Operational Timing ........................................................................................................... 758
20.4.5 Note...................................................................................................................... 707
20.5.1 Transition to Hardware Standby Mode................................................................ 708
20.5.2 Exit from Hardware Standby Mode..................................................................... 708
20.5.3 Timing for Hardware Standby Mode................................................................... 708
20.5.4 Timing for Hardware Standby Mode at Power-On.............................................. 709
20.6.1 Module Standby Timing ...................................................................................... 710
20.6.2 Read/Write in Module Standby............................................................................ 710
20.6.3 Usage Notes ......................................................................................................... 710
21.1.1 Absolute Maximum Ratings ................................................................................ 713
21.1.2 DC Characteristics ............................................................................................... 714
21.1.3 AC Characteristics ............................................................................................... 719
21.1.4 A/D Conversion Characteristics........................................................................... 725
21.1.5 D/A Conversion Characteristics........................................................................... 726
21.1.6 Flash Memory Characteristics ............................................................................. 727
21.2.1 Absolute Maximum Ratings ................................................................................ 728
21.2.2 DC Characteristics ............................................................................................... 729
21.2.3 AC Characteristics ............................................................................................... 734
21.2.4 A/D Conversion Characteristics........................................................................... 740
21.2.5 D/A Conversion Characteristics........................................................................... 741
21.2.6 Flash Memory Characteristics ............................................................................. 742
21.3.1 Absolute Maximum Ratings ................................................................................ 743
21.3.2 DC Characteristics ............................................................................................... 744
21.3.3 AC Characteristics ............................................................................................... 749
21.3.4 A/D Conversion Characteristics........................................................................... 755
21.3.5 D/A Conversion Characteristics........................................................................... 756
21.3.6 Flash Memory Characteristics ............................................................................. 757
21.4.1 Clock Timing ....................................................................................................... 758
21.4.2 Control Signal Timing ......................................................................................... 759
21.4.3 Bus Timing .......................................................................................................... 760
21.4.4 DRAM Interface Bus Timing .............................................................................. 766
21.4.5 TPC and I/O Port Timing..................................................................................... 769
21.4.6 Timer Input/Output Timing ................................................................................. 770
21.4.7 SCI Input/Output Timing..................................................................................... 771
21.4.8 DMAC Timing..................................................................................................... 772
Rev. 2.0, 06/04, page xxiii of xxiv