HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 176

MCU 5V 512K,PB-FREE 100-TQFP

HD64F3029XBL25V

Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3029XBL25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Areas 2 to 5: In external expansion mode, areas 2 to 5 are entirely external space.
When area 2 to 5 external space is accessed, signals CS
to CS
can be output.
2
5
Basic bus interface or DRAM interface can be selected for areas 2 to 5. With the DRAM
interface, signals CS
to CS
are used as RAS signals.
2
5
The size of areas 2 to 5 is 128 kbytes in modes 1 and 2, and 2 Mbytes in modes 3, 4, and 5.
Area 7: Area 7 includes the on-chip RAM and registers. In external expansion mode, the space
excluding the on-chip RAM and registers is external space. The on-chip RAM is enabled when
the RAME bit in the system control register (SYSCR) is set to 1; when the RAME bit is cleared to
0, the on-chip RAM is disabled and the corresponding space becomes external space .
When area 7 external space is accessed, the CS
signal can be output.
7
Only the basic bus interface can be used for the area 7 memory interface.
The size of area 7 is 128 kbytes in modes 1 and 2, and 2 Mbytes in modes 3, 4, and 5.
Rev. 2.0, 06/04, page 147 of 980

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