HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 260

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

If M (1 to 255) is the size of the block transferred at each request and N (1 to 65,536) is the
number of blocks to be transferred, then ETCRAH and ETCRAL should initially be set to M and
ETCRB should initially be set to N.
Figure 7.10 illustrates how block transfer mode operates. In this figure, bit TMS is cleared to 0,
meaning the block area is the destination.
T
B
Legend
L
L
M
N
T
B
T
B
A
A
A
B
A
A
B
B
= initial setting of MARA
= initial setting of MARB
= initial setting of ETCRAH and ETCRAL
= initial setting of ETCRB
= L
= L + SAIDE (
= L
= L + DAIDE (
A
A
B
B
Block 1
–
–
1)
1)
Block N
Block 2
SAID
DAID
Figure 7.10 Operation in Block Transfer Mode
(2
(2
DTSZ
DTSZ
M
M
M bytes or words are
transferred per request
–
–
1)
1)
Transfer
Block area
Rev. 2.0, 06/04, page 231 of 980
Address T
Address B
B
B