DF61654N50FTV Renesas Electronics America, DF61654N50FTV Datasheet - Page 902

IC H8SX/1654 MCU FLASH 120TQFP

DF61654N50FTV

Manufacturer Part Number
DF61654N50FTV
Description
IC H8SX/1654 MCU FLASH 120TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8SX/1600r
Datasheet

Specifications of DF61654N50FTV

Core Processor
H8SX
Core Size
32-Bit
Speed
50MHz
Connectivity
I²C, IrDA, SCI, SmartCard, USB
Peripherals
DMA, PWM, WDT
Number Of I /o
75
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
40K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
120-TQFP, 120-VQFP
For Use With
HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK1657 - DEV EVAL KIT FOR H8SX/1657
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF61654N50FTV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 21 Clock Pulse Generator
21.5.3
When using the crystal resonator, place the crystal resonator and its load capacitors as close to the
XTAL and EXTAL pins as possible. Other signal lines should be routed away from the oscillation
circuit as shown in Figure 21.7 to prevent induction from interfering with correct oscillation.
Figure 21.8 shows the external circuitry recommended for the PLL circuit. Separate PLLVcc and
PLLVss from the other Vcc and Vss lines at the board power supply source, and be sure to insert
bypass capacitors CPB and CB close to the pins.
Rev.1.00 Sep. 08, 2005 Page 852 of 966
REJ09B0219-0100
Notes on Board Design
Figure 21.8 Recommended External Circuitry for PLL Circuit
Figure 21.7 Note on Board Design for Oscillation Circuit
Note: * CB and CPB are laminated ceramic capacitors.
Inhibited
C
C
PLLV
PLLV
L2
L1
V
V
CC
CC
SS
SS
Signal A Signal B
Rp: 100
CPB: 0.1 µF *
CB: 0.1 µF *
XTAL
EXTAL
This LSI

Related parts for DF61654N50FTV