R4F24568NVFQV Renesas Electronics America, R4F24568NVFQV Datasheet - Page 413
R4F24568NVFQV
Manufacturer Part Number
R4F24568NVFQV
Description
MCU 128KKB FLASH 48K 144-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2400r
Specifications of R4F24568NVFQV
Core Processor
H8S/2600
Core Size
16/32-Bit
Speed
32MHz
Connectivity
EBI/EMI, I²C, IrDA, SCI, SSU, UART/USART, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
96
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
48K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 2x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
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H8S/2456, H8S/2456R, H8S/2454 Group
Section 7 DMA Controller (DMAC)
DREQ pin sampling is performed every cycle, with the rising edge of the next φ cycle after the
end of the DMABCR write cycle for setting the transfer enabled state as the starting point.
When the DREQ pin low level is sampled while acceptance by means of the DREQ pin is
possible, the request is held in the DMAC. Then, when activation is initiated in the DMAC, the
request is cleared, and DREQ pin high level sampling for edge detection is started. If DREQ pin
high level sampling has been completed by the time the DMA write cycle ends, acceptance
resumes after the end of the write cycle, DREQ pin low level sampling is performed again, and
this operation is repeated until the transfer ends.
REJ09B0467-0350 Rev. 3.50
Page 383 of 1392
Jul 07, 2010
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