R4F24568NVFQV Renesas Electronics America, R4F24568NVFQV Datasheet - Page 1344
R4F24568NVFQV
Manufacturer Part Number
R4F24568NVFQV
Description
MCU 128KKB FLASH 48K 144-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2400r
Specifications of R4F24568NVFQV
Core Processor
H8S/2600
Core Size
16/32-Bit
Speed
32MHz
Connectivity
EBI/EMI, I²C, IrDA, SCI, SSU, UART/USART, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
96
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
48K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 2x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
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Section 26 Electrical Characteristics
Note:
(4)
Table 26.23 DMAC Timing
Conditions: V
Page 1314 of 1392
Item
OE delay time 2*
Precharge time 1
Precharge time 2
Self-refresh precharge time 1
Self-refresh precharge time 2
WAIT setup time
WAIT hold time
BREQ setup time
BACK delay time
Bus floating time
BREQO delay time
Item
DREQ setup time
DREQ hold time
TEND delay time
DACK delay time 1
DACK delay time 2
DMAC Timing
*
t
OED1
φ = 8 MHz to 33 MHz
and t
CC
= 3.0 V to 3.6 V, AV
OED2
.correspond to OE-A and RD, and
Symbol
t
t
t
t
t
DRQS
DRQH
TED
DACD1
DACD2
Symbol
t
t
t
t
t
t
t
t
t
t
t
t
OED2
OED2B
PCH1
PCH2
RPS1
RPS2
WTS
WTH
BREQS
BACD
BZD
BRQOD
CC
= 3.0 V to 3.6 V, V
Min.
25
10
⎯
⎯
⎯
Min.
⎯
⎯
1.0 × t
1.5 × t
2.5 × t
3.0 × t
25
1
30
⎯
⎯
⎯
cyc
cyc
cyc
cyc
−20
−20
−20
−20
Max.
⎯
⎯
18
18
18
t
OED1B
Max.
15
19
⎯
⎯
⎯
⎯
⎯
⎯
⎯
15
40
25
ref
and t
= 3.0 V to AV
Unit
ns
OED2B
H8S/2456, H8S/2456R, H8S/2454 Group
.correspond to OE-B.
Test Conditions
Figure 26.34
Figure 26.32
Figures 26.31 and 26.32
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
REJ09B0467-0350 Rev. 3.50
CC
, V
SS
Test Conditions
Figures 26.8 to
26.23, 26.29, and
26.30
Figures 26.22
and 26.23
Figures 26.10,
26.16, and 26.35
Figure 26.24
Figure 26.25
= AV
SS
Jul 07, 2010
= 0 V,
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