R4F24568NVFQV Renesas Electronics America, R4F24568NVFQV Datasheet - Page 314

MCU 128KKB FLASH 48K 144-LQFP

R4F24568NVFQV

Manufacturer Part Number
R4F24568NVFQV
Description
MCU 128KKB FLASH 48K 144-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2400r
Datasheets

Specifications of R4F24568NVFQV

Core Processor
H8S/2600
Core Size
16/32-Bit
Speed
32MHz
Connectivity
EBI/EMI, I²C, IrDA, SCI, SSU, UART/USART, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
96
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
48K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 2x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
R4F24568NVFQV
Manufacturer:
REA
Quantity:
15
Part Number:
R4F24568NVFQV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
H8S/2456, H8S/2456R, H8S/2454 Group
Section 6 Bus Controller (BSC)
When DDS = 0 or EDDS = 0: When continuous synchronous DRAM space is accessed in
DMAC or EXDMAC single address transfer mode, full access (normal access) is always
performed. With the synchronous DRAM interface, the DACK or EDACK output goes low from
the T
state.
r
In modes other than DMAC or EXDMAC single address transfer mode, burst access can be used
when accessing continuous synchronous DRAM space.
Figure 6.73 shows the DACK or EDACK output timing for connecting the synchronous DRAM
interface when DDS = 0 or EDDS = 0.
Page 284 of 1392
REJ09B0467-0350 Rev. 3.50
Jul 07, 2010

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