HD6413007F20 Renesas Electronics America, HD6413007F20 Datasheet - Page 28

• Manufacturer Part Number: HD6413007F20
• Description: IC H8 MCU ROMLESS 5V 100QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD6413007F20

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 35
• Program Memory Type: ROMless
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Program Memory Size: -

Section 19 Power-Down State
19.1 Overview........................................................................................................................... 555
19.2 Register Configuration...................................................................................................... 557
19.3 Sleep Mode ....................................................................................................................... 562
19.4 Software Standby Mode.................................................................................................... 563
19.5 Hardware Standby Mode .................................................................................................. 566
19.6 Module Standby Function................................................................................................. 567
19.7 System Clock Output Disabling Function......................................................................... 568
Section 20 Electrical Characteristics
20.1 Absolute Maximum Ratings ............................................................................................. 569
20.2 Electrical Characteristics................................................................................................... 570
20.3 Operational Timing........................................................................................................... 591
Rev.5.00 Sep. 12, 2007 Page xxvi of xxviii
REJ09B0396-0500
18.5.1 Register Configuration......................................................................................... 553
18.5.2 Division Control Register (DIVCR) .................................................................... 553
18.5.3 Usage Notes ......................................................................................................... 554
19.2.1 System Control Register (SYSCR) ...................................................................... 557
19.2.2 Module Standby Control Register H (MSTCRH)................................................ 559
19.2.3 Module Standby Control Register L (MSTCRL)................................................. 560
19.3.1 Transition to Sleep Mode..................................................................................... 562
19.3.2 Exit from Sleep Mode.......................................................................................... 562
19.4.1 Transition to Software Standby Mode ................................................................. 563
19.4.2 Exit from Software Standby Mode ...................................................................... 563
19.4.3 Selection of Waiting Time for Exit from Software Standby Mode...................... 564
19.4.4 Sample Application of Software Standby Mode.................................................. 565
19.4.5 Note...................................................................................................................... 565
19.5.1 Transition to Hardware Standby Mode................................................................ 566
19.5.2 Exit from Hardware Standby Mode ..................................................................... 566
19.5.3 Timing for Hardware Standby Mode ................................................................... 566
19.6.1 Module Standby Timing ...................................................................................... 567
19.6.2 Read/Write in Module Standby............................................................................ 567
19.6.3 Usage Notes ......................................................................................................... 567
20.2.1 DC Characteristics ............................................................................................... 570
20.2.2 AC Characteristics ............................................................................................... 580
20.2.3 A/D Conversion Characteristics........................................................................... 588
20.2.4 D/A Conversion Characteristics........................................................................... 590
20.3.1 Clock Timing ....................................................................................................... 591
20.3.2 Control Signal Timing ......................................................................................... 592
20.3.3 Bus Timing .......................................................................................................... 593
......................................................................................... 555
............................................................................. 569