HD6413007F20 Renesas Electronics America, HD6413007F20 Datasheet - Page 182

IC H8 MCU ROMLESS 5V 100QFP

HD6413007F20

Manufacturer Part Number
HD6413007F20
Description
IC H8 MCU ROMLESS 5V 100QFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD6413007F20

Core Processor
H8/300H
Core Size
16-Bit
Speed
20MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
35
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD6413007F20V
Manufacturer:
RENESAS-Pb free
Quantity:
2
6. Bus Controller
6.5.8
In a DRAM access cycle, wait states can be inserted (1) between the T
between the T
Insertion of T
by setting the RCW bit to 1 in DRCRB.
Insertion of T
area designated as DRAM space is set to 1, from 0 to 3 T
state and T
Figure 6.18 shows an example of the timing for wait state insertion.
The settings of the RCW bit in DRCRB and of ASTCR, WCRH, and WCRL do not affect refresh
cycles. Wait states cannot be inserted in a DRAM space access cycle by means of the WAIT pin.
Rev.5.00 Sep. 12, 2007 Page 152 of 764
REJ09B0396-0500
Wait Control
c2
Read access
Write access
state by means of settings in WCRH and WCRL.
c1
rw
w
Figure 6.18 Example of Wait State Insertion Timing (CSEL = 0)
state and T
Wait State(s) between T
Wait State between T
(UCAS /LCAS)
(UCAS /LCAS)
Note: n = 2 to 5
c2
PB4 /PB5
PB4 /PB5
state.
CSn(RAS)
RD(WE)
D
D
A
RD(WE)
23
15
15
φ
to A
to D
to D
AS
0
0
0
r
and T
c1
and T
T
p
c1
: One T
c2
Tr
: When the bit in ASTCR corresponding to an
Row
Trw
rw
w
state can be inserted between T
states can be inserted between the T
High
High
T
c1
Column
Tw
Write data
r
state and T
Tw
Read data
T
c2
c1
state, and (2)
r
and T
c1
c1

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