TMP92xy21FG Toshiba, TMP92xy21FG Datasheet - Page 468

• Manufacturer Part Number: TMP92xy21FG
• Manufacturer: Toshiba

Specifications of TMP92xy21FG

• Package: LQFP144
• Rom Types(m=mask,p=otp, F=flash,e=eeprom): Romless
• Rom Combinations: Romless
• Ram Combinations: 16
• Architecture: 32-bit CISC
• Usb/spi Channels: -
• Uart/sio Channels: 2
• I2c/sio Bus Channels: -
• (s)dram Controller: 1
• Adc 10-bit Channel: 4
• Da Converter: -
• Timer 8-bit Channel: 4
• Timer 16-bit Channel: 1
• Pwm 8-bit Channels: -
• Pwm 16-bit Channels: -
• Cs/wait Controller: 4
• Dual Clock: Y
• Number Of I/o Ports: 82
• Power Supply Voltage(v): 3.0 to 3.6

4.
4.1
Electrical Characteristics
Test
parameter
Solderability
Absolute Maximum Ratings
Solderability
Power Supply Voltage
Input Voltage
Output Current
Output Current (MX, MY pin)
Output Current
Output Current (PX, PY pin)
Output Current (Total)
Output Current (Total)
Power Dissipation (Ta = 85°C)
Soldering Temperature (10 s)
Storage Temperature
Operation Temperature
Note: The absolute maximum ratings are rated values which must not be exceeded
Test condition
(1) Use of Sn-37Pb solder Bath
(2) Use of Sn-3.0Ag-0.5Cu solder bath
during operation, even for an instant. Any one of the ratings must not be
exceeded. If any absolute maximum rating is exceeded, the device may break
down or its performance may be degraded, causing it to catch fire or explode
resulting in injury to the user. Thus, when designing products which include this
device, ensure that no absolute maximum rating value will ever be exceeded.
Parameter
Solder bath temperature =230°C, Dipping time = 5 seconds
The number of times = one, Use of R-type flux
Solder bath temperature =245°C, Dipping time = 5 seconds
The number of times = one, Use of R-type flux
Symbol
T
SOLDER
Σ I
T
T
Σ I
V
92CH21-466
V
I
I
I
I
P
OPR
STG
OH
OH
OL
OL
CC
IN
OH
OL
D
−0.5 to VCC + 0.5
−0.5 to 4.0
−65 to 150
−20 to 70
Rating
−15
−80
600
260
15
80
−2
2
Note
Pass:
solderability rate until forming ≥ 95%
Unit
mW
mA
mA
mA
mA
mA
mA
°C
°C
°C
V
V
TMP92CH21
2009-06-19