M-V850E-IA4 Renesas Electronics America, M-V850E-IA4 Datasheet - Page 806

• Manufacturer Part Number: M-V850E-IA4
• Description: KIT EVAL V850E IA4 UPD70F3186
• Manufacturer: Renesas Electronics America

Specifications of M-V850E-IA4

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

μ
μ
μ
μ
μ
μ
μ
μ
804
PD703183GC-×××-8BT-A:
PD70F3184GC-8BT-A:
PD703185GC-×××-8EU-A:
PD703185GF-×××-3BA-A:
PD703186GC-×××-8EU-A:
PD703186GF-×××-3BA-A:
PD70F3186GC-8EU-A:
PD70F3186GF-3BA-A:
Infrared reflow
Wave soldering
Partial heating
Soldering Method
These products should be soldered and mounted under the following recommended conditions.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Remarks 1. Products with -A at the end of the part number are lead-free products.
2. For soldering methods and conditions other than those recommended, please contact an NEC
Electronics sales representative.
Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),
Count: 3 times or less, Exposure limit: 3 days
72 hours)
For details, contact an NEC Electronics sales representative.
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
CHAPTER 26 RECOMMENDED SOLDERING CONDITIONS
Table 26-1. Surface Mounting Type Soldering Conditions
80-pin plastic QFP (14 × 14)
80-pin plastic QFP (14 × 14)
100-pin plastic LQFP (fine pitch) (14 × 14)
100-pin plastic QFP (14 × 20)
100-pin plastic LQFP (fine pitch) (14 × 14)
100-pin plastic QFP (14 × 20)
100-pin plastic LQFP (fine pitch) (14 × 14)
100-pin plastic QFP (14 × 20)
User’s Manual U16543EJ4V0UD
Soldering Conditions
Note
(after that, prebake at 125°C for 20 to
Recommended
IR60-203-3
Condition
Symbol
–
–