D6417729RHF200BV Renesas Electronics America, D6417729RHF200BV Datasheet - Page 34

• Manufacturer Part Number: D6417729RHF200BV
• Description: IC SUPER H MPU ROMLESS 208QFP
• Manufacturer: Renesas Electronics America
• Series: SuperH® SH7700r

Specifications of D6417729RHF200BV

• Core Processor: SH-3 DSP
• Core Size: 32-Bit
• Speed: 200MHz
• Connectivity: EBI/EMI, FIFO, IrDA, SCI, SmartCard
• Peripherals: DMA, POR, WDT
• Number Of I /o: 96
• Program Memory Type: ROMless
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 1.85 V ~ 2.15 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 208-QFP Exposed Pad, 208-eQFP, 208-HQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -

24.3 AC Characteristics............................................................................................................. 706
24.4 A/D Converter Characteristics........................................................................................... 757
24.5 D/A Converter Characteristics........................................................................................... 757
Appendix A Pin Functions
A.1
A.2
A.3
A.4
Appendix B Memory-Mapped Control Registers
B.1
B.2
Appendix C Product Lineup
Appendix D Package Dimensions
Rev. 5.0, 09/03, page xxxii of xlvi
24.3.1 Clock Timing........................................................................................................ 707
24.3.2 Control Signal Timing.......................................................................................... 713
24.3.3 AC Bus Timing .................................................................................................... 716
24.3.4 Basic Timing ........................................................................................................ 718
24.3.5 Burst ROM Timing .............................................................................................. 721
24.3.6 Synchronous DRAM Timing ............................................................................... 724
24.3.7 PCMCIA Timing.................................................................................................. 742
24.3.8 Peripheral Module Signal Timing ........................................................................ 749
24.3.9 UDI-Related Pin Timing ...................................................................................... 753
24.3.10 AC Characteristic Test Conditions ....................................................................... 755
24.3.11 Delay Time Variation Due to Load Capacitance.................................................. 756
Pin States ........................................................................................................................... 759
Pin Specifications .............................................................................................................. 763
Treatment of Unused Pins ................................................................................................. 768
Pin States in Access to Each Address Space ..................................................................... 769
Register Address Map ....................................................................................................... 783
Register Bits ...................................................................................................................... 789
................................................................................................ 759
............................................................................................. 802
................................................................................... 803
....................................................... 783