LPC1769FBD100,551 NXP Semiconductors, LPC1769FBD100,551 Datasheet - Page 582
LPC1769FBD100,551
Manufacturer Part Number
LPC1769FBD100,551
Description
IC ARM CORTEX MCU 512K 100-LQFP
Manufacturer
NXP Semiconductors
Series
LPC17xxr
Datasheets
1.OM11043.pdf
(79 pages)
2.LPC1767FBD100551.pdf
(2 pages)
3.LPC1767FBD100551.pdf
(840 pages)
4.LPC1769FBD100551.pdf
(66 pages)
Specifications of LPC1769FBD100,551
Program Memory Type
FLASH
Program Memory Size
512KB (512K x 8)
Package / Case
100-LQFP
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
120MHz
Connectivity
CAN, Ethernet, I²C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Number Of I /o
70
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
2.4 V ~ 3.6 V
Data Converters
A/D 8x12b, D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC17
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
64 KB
Interface Type
Ethernet, USB, OTG, CAN
Maximum Clock Frequency
120 MHz
Number Of Programmable I/os
70
Number Of Timers
4
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, MCB1760, MCB1760U, MCB1760UME
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 8 Channel
On-chip Dac
10 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4966
935290522551
935290522551
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC1769FBD100,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
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30.1 Basic configuration
30.2 Features
30.3 Pin description
Table 537. D/A Pin Description
UM10360
User manual
Pin
AOUT
V
V
REFP
DDA
, V
, V
SSA
REFN
Type
Output
Reference
Power
The DAC is configured using the following registers:
Table 537
1. Power: The DAC is always connected to V
2. Clock: In the PCLKSEL0 register
3. Pins: Enable the DAC pin through the PINSEL registers. Select pin mode for port pin
4. DMA: The DAC can be connected to the GPDMA controller (see
•
•
•
•
•
•
UM10360
Chapter 30: LPC17xx Digital-to-Analog Converter (DAC)
Rev. 2 — 19 August 2010
PINSEL and PINMODE settings (see below).
with DAC through the PINMODE registers
accessing any DAC registers.
GPDMA connections, see
10-bit digital to analog converter
Resistor string architecture
Buffered output
Power-down mode
Selectable speed vs. power
Maximum update rate of 1 MHz.
Description
Analog Output. After the selected settling time after the DACR is written with a new value,
the voltage on this pin (with respect to V
Voltage References. These pins provide a voltage reference level for the ADC and DAC.
Note: V
DAC are not used.
Analog Power and Ground. These should typically be the same voltages as V
but should be isolated to minimize noise and error. Note: VDDA should be tied to VDD(3V3)
and VSSA should be tied to VSS if the ADC and DAC are not used.
gives a brief summary of each of DAC related pins.
REFP
All information provided in this document is subject to legal disclaimers.
should be tied to VDD(3V3) and V
Rev. 2 — 19 August 2010
Table
543.
(Table
SSA
) is VALUE × ((V
40), select PCLK_DAC.
DDA
(Section
REFN
. Register access is determined by
should be tied to V
8.5). This must be done before
REFP
- V
REFN
Section
)/1024) + V
© NXP B.V. 2010. All rights reserved.
SS
if the ADC and
User manual
DD
30.4.2). For
and V
REFN
582 of 840
SS
.
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