LPC1769FBD100,551 NXP Semiconductors, LPC1769FBD100,551 Datasheet - Page 418
LPC1769FBD100,551
Manufacturer Part Number
LPC1769FBD100,551
Description
IC ARM CORTEX MCU 512K 100-LQFP
Manufacturer
NXP Semiconductors
Series
LPC17xxr
Datasheets
1.OM11043.pdf
(79 pages)
2.LPC1767FBD100551.pdf
(2 pages)
3.LPC1767FBD100551.pdf
(840 pages)
4.LPC1769FBD100551.pdf
(66 pages)
Specifications of LPC1769FBD100,551
Program Memory Type
FLASH
Program Memory Size
512KB (512K x 8)
Package / Case
100-LQFP
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
120MHz
Connectivity
CAN, Ethernet, I²C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Number Of I /o
70
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
2.4 V ~ 3.6 V
Data Converters
A/D 8x12b, D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC17
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
64 KB
Interface Type
Ethernet, USB, OTG, CAN
Maximum Clock Frequency
120 MHz
Number Of Programmable I/os
70
Number Of Timers
4
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, MCB1760, MCB1760U, MCB1760UME
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 8 Channel
On-chip Dac
10 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4966
935290522551
935290522551
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC1769FBD100,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
- OM11043 PDF datasheet
- LPC1767FBD100551 PDF datasheet #2
- LPC1767FBD100551 PDF datasheet #3
- LPC1769FBD100551 PDF datasheet #4
- Current page: 418 of 840
- Download datasheet (6Mb)
NXP Semiconductors
UM10360
User manual
18.5.2.5 SPI format with CPOL = 1,CPHA = 1
18.5.3 National Semiconductor Microwire frame format
The transfer signal sequence for SPI format with CPOL = 1, CPHA = 1 is shown in
Figure
In this configuration, during idle periods:
If the SSP is enabled and there is valid data within the transmit FIFO, the start of
transmission is signified by the SSEL master signal being driven LOW. Master’s MOSI is
enabled. After a further one half SCK period, both master and slave data are enabled onto
their respective transmission lines. At the same time, the SCK is enabled with a falling
edge transition. Data is then captured on the rising edges and propagated on the falling
edges of the SCK signal.
After all bits have been transferred, in the case of a single word transmission, the SSEL
line is returned to its idle HIGH state one SCK period after the last bit has been captured.
For continuous back-to-back transmissions, the SSEL pins remains in its active LOW
state, until the final bit of the last word has been captured, and then returns to its idle state
as described above. In general, for continuous back-to-back transfers the SSEL pin is
held LOW between successive data words and termination is the same as that of the
single word transfer.
Figure 81
format when back-to-back frames are transmitted.
Fig 80. SPI Frame Format with CPOL = 1 and CPHA = 1
•
•
•
The CLK signal is forced HIGH.
SSEL is forced HIGH.
The transmit MOSI/MISO pad is in high impedance.
80, which covers both single and continuous transfers.
shows the Microwire frame format for a single frame.
All information provided in this document is subject to legal disclaimers.
SSEL
MOSI
MISO
SCK
Rev. 2 — 19 August 2010
Q
MSB
MSB
4 to 16 bits
LSB
LSB
Chapter 18: LPC17xx SSP0/1
Figure 82
Q
UM10360
© NXP B.V. 2010. All rights reserved.
shows the same
418 of 840
Related parts for LPC1769FBD100,551
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
32-bit Arm Cortex-m3 Microcontroller; Up To 512 Kb Flash And 64 Kb Sram With Ethernet, Usb 2.0 Host/device/otg, Can
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2420/2460 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2458 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2468 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2470 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2478 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The XA-S3 device is a member of Philips Semiconductors? XA(eXtended Architecture) family of high performance 16-bitsingle-chip microcontrollers
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP BlueStreak LH75401/LH75411 family consists of two low-cost 16/32-bit System-on-Chip (SoC) devices
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP LPC3130/3131 combine an 180 MHz ARM926EJ-S CPU core, high-speed USB2
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP LPC3141 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3143 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3152 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3154 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors