MC68360VR25VL Freescale Semiconductor, MC68360VR25VL Datasheet - Page 814
MC68360VR25VL
Manufacturer Part Number
MC68360VR25VL
Description
IC MPU QUICC 25MHZ 357-PBGA
Manufacturer
Freescale Semiconductor
Datasheets
1.MC68EN360VR25L.pdf
(14 pages)
2.MC68EN360VR25L.pdf
(2 pages)
3.MC68360AI25L.pdf
(962 pages)
Specifications of MC68360VR25VL
Processor Type
M683xx 32-Bit
Speed
25MHz
Voltage
3.3V
Mounting Type
Surface Mount
Package / Case
357-PBGA
Family Name
M68000
Device Core
ColdFire
Device Core Size
32b
Frequency (max)
25MHz
Instruction Set Architecture
RISC
Operating Supply Voltage (max)
3.3V
Operating Supply Voltage (min)
2.7V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
357
Package Type
BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Compliant
Available stocks
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Manufacturer
Quantity
Price
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Part Number:
MC68360VR25VL
Manufacturer:
Exar
Quantity:
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Company:
Part Number:
MC68360VR25VL
Manufacturer:
Freescale Semiconductor
Quantity:
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Electrical Characteristics
10.2 THERMAL CHARACTERISTICS
10.3 POWER CONSIDERATIONS
The average chip-junction temperature, T J , in C can be obtained from:
For most applications, P I/O < 0.3*P INT and can be neglected.
An approximate relationship between P D and T J (if P I/O is neglected) is:
10-2
where:
T A =
P D =
PINT =
P I/O =
JA =
T J = T A + (P D • JA )
P D = K
Solving Equations (1) and (2) for K gives:
K = P D • (T A + 273 C) + JA • P D
Ambient Temperature, C
Package Thermal Resistance, Junction-to-Ambient, C/W
P INT + P I/O
I CC x V CC , Watts—Chip Internal Power
Power Dissipation on Input and Output Pins—User Determined
(T J + 273 C)
Thermal Resistance—Junction to Case
Thermal Resistance—Junction to Ambient
Thermal Resistance—Junction to Ambient
Notes:
1. Assumes natural convection and a single layer board (no thermal vias).
2. Assumes natural convection, a multi layer board with thermal vias
3. Assumes natural convection, a multi layer board with thermal vias
4. For more information on the design of thermal vias on multilayer boards and
68360 dissipation, and a board temperature rise of 30 C above ambient.
68360 dissipation, and a board temperature rise of 15 C above ambient.
BGA layout considerations in general, refer to AN-1231/D, “Plastic Ball Grid
Array Application Note” available from your local Motorola sales office.
T
J
= T
P
where:
240-Pin QFP
241-Pin PGA
357-Pin BGA
240-Pin QFP
241-Pin PGA
357-pin BGA
D
P
A
= (V
I/O
+ (P
Freescale Semiconductor, Inc.
is the power dissipation on pins.
DD
For More Information On This Product,
D
Characteristic
•
•
I
JA
DD
MC68360 USER’S MANUAL
)
) + P
Go to: www.freescale.com
I/O
2
Symbol
JC
JA
JA
Value
27.4
22.8
47
30
20
2
7
8
1
2
3
4
4
, 1.5 watt
,1.5 watt
Unit
C/W
C/W
C/W
(1)
(2)
(3)
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