DF2170VTE33 Renesas Electronics America, DF2170VTE33 Datasheet - Page 94

• Manufacturer Part Number: DF2170VTE33
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2170VTE33

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: SCI, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 76
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Data Converters: -
• Other names: HD64F2170VTE33; HD64F2170VTE33

4.6
Figure 4.2 shows the stack after completion of trap instruction exception handling and interrupt
exception handling.
4.7
When accessing word data or longword data, this LSI assumes that the lowest address bit is 0. The
stack should always be accessed in words or longwords, and the value of the stack pointer (SP:
ER7) should always be kept even.
Use the following instructions to save registers:
Use the following instructions to restore registers:
Setting SP to an odd value may lead to a malfunction. Figure 4.3 shows an operation example
when the SP value is odd.
Rev. 2.00, 03/04, page 60 of 534
PUSH.W
PUSH.L
POP.W
POP.L
Stack Status after Exception Handling
Usage Note
Rn
Rn
ERn
ERn
Figure 4.2 Stack Status after Exception Handling
(or
(or
(or
(or
MOV.W Rn, @-SP
MOV.W @SP+, Rn
MOV.L ERn, @-SP
MOV.L @SP+, ERn
SP
(24 bits)
CCR
PC
)
)
)
)