DF2170VTE33 Renesas Electronics America, DF2170VTE33 Datasheet - Page 564

MCU 3V 256K 100-TQFP

DF2170VTE33

Manufacturer Part Number
DF2170VTE33
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet

Specifications of DF2170VTE33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
SCI, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
76
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Other names
HD64F2170VTE33
HD64F2170VTE33

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2170VTE33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Rev. 2.00, 03/04, page 530 of 534
Item
Figure 18.29 VCL
Capacitor Connection
Method
Page
522
Revisions (See Manual for Details)
Figure 18.29 amended
An external capacitor to
stabilize the internal voltage
One 0.1-µF capacitor
VDo not connect the Vcc power-supply to the VCL pin.
If connected, the LSI may be permanently damaged.
Connect the VCC power-Supply to the other Vcc pin in the usual way.
Use a multilayer ceramic capacitor (one 0.1-µF capacitor) for this circuit,
and place it/them near the VCL pin.
VCL
VSS

Related parts for DF2170VTE33