DF2170VTE33 Renesas Electronics America, DF2170VTE33 Datasheet - Page 326

MCU 3V 256K 100-TQFP

DF2170VTE33

Manufacturer Part Number
DF2170VTE33
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet

Specifications of DF2170VTE33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
SCI, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
76
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Other names
HD64F2170VTE33
HD64F2170VTE33

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2170VTE33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
11.2
Table 11.1 shows the pin configuration of the SCI.
Table 11.1 Pin Configuration
Note:
Rev. 2.00, 03/04, page 292 of 534
Channel
0
RxD
TxD
[Legend]
RSR :
RDR :
TSR :
TDR :
SMR :
SCR :
SSR :
BRR :
*
Input/Output Pins
Pin names RxD and TxD are used in the text, omitting the channel designation.
Transmit shift register
Transmit data register
Serial status register
Receive shift register
Serial control register
Bit rate register
Receive data register
Serial mode register
Pin Name*
RxD0
TxD0
RDR
RSR
Figure 11.1 Block Diagram of SCI
Parity generation
Parity check
TDR
TSR
I/O
Input
Output
Module data bus
reception control
Transmission/
SMR
SSR
SCR
Channel 0 transmit data output
Function
Channel 0 receive data input
Clock
Baud rate
generator
BRR
TEI
TXI
RXI
ERI
φ
φ/4
φ/16
φ/64
data bus
Internal

Related parts for DF2170VTE33