DF2170VTE33 Renesas Electronics America, DF2170VTE33 Datasheet - Page 405

• Manufacturer Part Number: DF2170VTE33
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2170VTE33

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: SCI, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 76
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Data Converters: -
• Other names: HD64F2170VTE33; HD64F2170VTE33

This LSI has an on-chip high-speed static RAM. The RAM is connected to the CPU by a 16-bit
data bus and is connected to the DMAC by a 32-bit data bus, enabling one-state access to byte
data, word data, and longword data (note that two-state access is used when the RAM is accessed
by using the longword access instruction such as MOV.L by the CPU).
The on-chip RAM can be enabled or disabled by means of the RAME bit in the system control
register (SYSCR). For details on the system control register (SYSCR), refer to section 3.2.2,
System Control Register (SYSCR).
Product Type
H8S/2170
HD64F2170
ROM Type
Flash memory version
Section 13 RAM
RAM
Capacity
32 kbytes
Rev. 2.00, 03/04, page 371 of 534
RAM Address
H'FF7000 to H'FFEFFF