DF2170VTE33 Renesas Electronics America, DF2170VTE33 Datasheet - Page 384

• Manufacturer Part Number: DF2170VTE33
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2170VTE33

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: SCI, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 76
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Data Converters: -
• Other names: HD64F2170VTE33; HD64F2170VTE33

Rev. 2.00, 03/04, page 350 of 534
Yes
Clear EP1 FIFO full status
Set EP1 FIFO full status
(EP1 FULL in IFR0 = 1)
(EP1 FULL in IFR0 = 0)
Receive data from host
ACK
any space in both EP1
Receive PING token
Receive OUT token
Is there any space
any space in other
Is receive data
in EP1 FIFO?
EP1 FIFO?
Yes
length 0?
Yes
Yes
Is there
Is there
FIFOs?
No
ACK (for only PING)
Figure 12.10 EP1 Bulk-Out Transfer Operation
USB function
NYET (High speed)
ACK (Full speed)
No
No
No
Full speed
High speed
NAK
Set EP1 FIFO full status
(EP1 FULL in IFR0 = 1)
Interrupt generated
Interrupt generated
Confirm receive data length from
EP1 receive data size register
data register (EPDR1)
Read data from EP1
Firmware
(EPSZ1)