DF2170VTE33 Renesas Electronics America, DF2170VTE33 Datasheet - Page 241

MCU 3V 256K 100-TQFP

DF2170VTE33

Manufacturer Part Number
DF2170VTE33
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet

Specifications of DF2170VTE33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
SCI, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
76
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Other names
HD64F2170VTE33
HD64F2170VTE33

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2170VTE33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
External Request/Cycle Steal Mode/Block Transfer Mode: In block transfer mode, transfer of
one block is performed continuously in the same way as in burst mode. The timing of the start of
the next block transfer is the same as in normal transfer mode. If a transfer request is generated for
another channel, an DMA cycle for the other channel is generated before the next block transfer.
The DREQ pin sensing timing is different for low level sensing and falling edge sensing. The
same applies to transfer request acceptance and transfer start timing.
Figures 7.42 to 7.45 show operation timing examples for various conditions.
• No contention/dual address mode/low level sensing (see figure 7.42)
• No contention/single address mode/falling edge sensing (see figure 7.43)
• CPU cycles/single address mode/low level sensing (see figure 7.44)
• Contention with another channel/dual address mode/low level sensing (see figure 7.45)
Rev. 2.00, 03/04, page 207 of 534

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