DF2170VTE33 Renesas Electronics America, DF2170VTE33 Datasheet - Page 438

• Manufacturer Part Number: DF2170VTE33
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2170VTE33

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: SCI, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 76
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Data Converters: -
• Other names: HD64F2170VTE33; HD64F2170VTE33

Rev. 2.00, 03/04, page 404 of 534
(Program end notice)
2.
4.
(reset by boot mode)
Wait for program data
programming/erasing
Boot mode initiation
setting command
Figure 14.8 Overview of Boot Mode State Transition Diagram
Wait for inquiry
3.
command
Wait for
user boot MAT erasure
(Program command reception)
(Erasure end selection
command reception)
All user MAT and
(Program data transmission)
Inquiry command response
H'00.......H'00 reception
(adjustment completed)
Inquiry command reception
Read/check command
reception
(Bit rate adjustment)
H'00 transmission
Command response
(Erasure selection command reception)
read/check command
Bit rate adjustment
Wait for erase-block
Processing of
inquiry setting
Processing of
command
data
(Erase-block specification)
1.