DF2170VTE33 Renesas Electronics America, DF2170VTE33 Datasheet - Page 386

• Manufacturer Part Number: DF2170VTE33
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2170VTE33

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: SCI, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 76
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Data Converters: -
• Other names: HD64F2170VTE33; HD64F2170VTE33

Rev. 2.00, 03/04, page 352 of 534
(EP2 EMPTY in IFR0 = 0)
Clear EP2 empty status
Transmit data to host
Is there any space
Receive IN token
in EP2 FIFO?
in EP2 FIFO?
Valid data
Yes
No
ACK
USB function
Figure 12.11 EP2 Bulk-In Transfer Operation
Yes
No
NAK
(EP2 EMPTY in IFR0 = 1)
Set EP2 empty status
Interrupt generated
to packet enable register 2 (EPDR2)
Write number of transmit data bytes
Disable EP2 FIFO empty interrupt
Enable EP2 FIFO empty interrupt
Write one-packet data to EP2
(EP2 EMPTY in IER0 = 1)
(EP2 EMPTY in IER0 = 0)
any data to be transmitted
data register (EPDR2)
been transmitted
Has all data
Firmware
to host?
to host?
Is there
Yes
No
Yes
No