DF2170VTE33 Renesas Electronics America, DF2170VTE33 Datasheet - Page 543
![MCU 3V 256K 100-TQFP](/photos/28/61/286108/100-tqfp_sml.jpg)
DF2170VTE33
Manufacturer Part Number
DF2170VTE33
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet
1.DF2170BVTE33V.pdf
(572 pages)
Specifications of DF2170VTE33
Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
SCI, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
76
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Other names
HD64F2170VTE33
HD64F2170VTE33
HD64F2170VTE33
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF2170VTE33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
- Current page: 543 of 572
- Download datasheet (4Mb)
Read
(RDNn = 1)
Read
(RDNn = 0)
Write
Figure 18.11 Basic Bus Timing: Three-State Access (CS Assertion Period Extended)
to
φ
A23 to A0
D15 to D0
D15 to D0
D15 to D0
to
,
t
CSD1
t
AD
t
WDD
Th
t
t
t
AS1
AS3
t
AS3
DACD1
t
ASD
t
AS4
t
WDS3
T1
t
t
RSD1
RSD1
t
AC6
t
WRD1
T2
t
AC4
t
WSW2
t
Rev. 2.00, 03/04, page 509 of 534
WRD2
t
RSD1
t
RDS1
T3
t
t
RSD2
RDH1
t
RDS2
t
RDH2
t
ASD
t
t
t
WDH3
AH3
Tt
AH3
t
AH2
t
AH1
t
DACD2
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