DF2170VTE33 Renesas Electronics America, DF2170VTE33 Datasheet - Page 165

• Manufacturer Part Number: DF2170VTE33
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2170VTE33

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: SCI, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 76
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Data Converters: -
• Other names: HD64F2170VTE33; HD64F2170VTE33

6.6.10
When DRAM with a ×16-bit configuration is connected, the 2-CAS access method is used for the
control signals needed for byte access. Figure 6.29 shows the control timing for 2-CAS access, and
figure 6.30 shows an example of 2-CAS DRAM connection.
Figure 6.29 2-CAS Control Timing (Write Access to Even Address: RAST = 0, CAST = 0)
Byte Access Control
φ
Address bus
D15 to D8
D7 to D0
(
(
(
)
)
)
T
p
Row address
High
High
T
r
T
c1
Column address
Rev. 2.00, 03/04, page 131 of 534
T
c2