DF2170VTE33 Renesas Electronics America, DF2170VTE33 Datasheet - Page 409
![MCU 3V 256K 100-TQFP](/photos/28/61/286108/100-tqfp_sml.jpg)
DF2170VTE33
Manufacturer Part Number
DF2170VTE33
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet
1.DF2170BVTE33V.pdf
(572 pages)
Specifications of DF2170VTE33
Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
SCI, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
76
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Other names
HD64F2170VTE33
HD64F2170VTE33
HD64F2170VTE33
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF2170VTE33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
- Current page: 409 of 572
- Download datasheet (4Mb)
14.1.1
When each mode pin and the FWE pin are set in the reset state and reset start is performed, this
LSI enters each operating mode as shown in figure 14.2.
• Flash memory can be read in user mode, but cannot be programmed or erased.
• Flash memory can be read, programmed, or erased on the board only in user program mode,
• Flash memory can be read, programmed, or erased by means of the PROM programmer in
user boot mode, and boot mode.
programmer mode.
User mode
Operating Mode
FWE = 0
FWE = 1
Figure 14.2 Mode Transition of Flash Memory
User program
mode
Reset state
On-board programming mode
User boot
Programmer mode setting
mode
Rev. 2.00, 03/04, page 375 of 534
=
0
Boot mode
Programmer
mode
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