DF2170VTE33 Renesas Electronics America, DF2170VTE33 Datasheet - Page 456
![MCU 3V 256K 100-TQFP](/photos/28/61/286108/100-tqfp_sml.jpg)
DF2170VTE33
Manufacturer Part Number
DF2170VTE33
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet
1.DF2170BVTE33V.pdf
(572 pages)
Specifications of DF2170VTE33
Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
SCI, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
76
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Other names
HD64F2170VTE33
HD64F2170VTE33
HD64F2170VTE33
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF2170VTE33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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Table 14.9 (2)
Rev. 2.00, 03/04, page 422 of 534
Item
Operation for Selection
of On-chip Program to
be Downloaded
Operation for Writing
H'A5 to FKEY
Execution of Writing
SC0 = 1 to FCCS
(Download)
Operation for FKEY
Clear
Determination of
Download Result
Operation for
Download Error
Operation for Settings
of Initial Parameter
Execution of
Initialization
Determination of
Initialization Result
Operation for
Initialization Error
NMI Handling Routine
Operation for Inhibit of
Interrupt
Operation for Writing
H'5A to FKEY
Operation for Settings
of Erasure Parameter
Execution of Erasure
Determination of
Erasure Result
Useable Area for Erasure in User Program Mode
On-chip
RAM
Storable /Executable Area
User
MAT
×
×
×
×
×
×
External Space
(Expanded Mode) User MAT
×
×
×
Selected MAT
Embedded
Program
Storage Area
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