DF2170VTE33 Renesas Electronics America, DF2170VTE33 Datasheet - Page 402

MCU 3V 256K 100-TQFP

DF2170VTE33

Manufacturer Part Number
DF2170VTE33
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet

Specifications of DF2170VTE33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
SCI, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
76
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Other names
HD64F2170VTE33
HD64F2170VTE33

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2170VTE33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
12.8.15 External Physical Layer LSI
The pin name, usage, and type may differ according to each of external physical layer LSI. Check
and confirm the specifications of it before connecting to this LSI.
12.8.16 Operation at the Bus Reset Reception
When a bus reset is received from the host, there will be a defect in the operation described below.
When the first bus reset from the host completes, and then the second bus reset is received without
following bus accesses of SOF or data transfer, the second bus reset will not be received
successfully (shown in case 2 in figure 12.19).
Note: Since the successive bus resets are not normally required, the bus reset does not occur
In order to detect the bus reset correctly, even in the case 2, follow the procedure shown in figure
12.20.
Rev. 2.00, 03/04, page 368 of 534
successively with following no data transfer.
Figure 12.19 Bus Reset Following Completion of First Bus Reset
Case 1
Case 2
Bus reset (first)
Bus reset (first)
SOF, etc.
No transfer (Idle)
Bus reset (second)
Bus reset (second)

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