DF2170VTE33 Renesas Electronics America, DF2170VTE33 Datasheet - Page 138

MCU 3V 256K 100-TQFP

DF2170VTE33

Manufacturer Part Number
DF2170VTE33
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet

Specifications of DF2170VTE33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
SCI, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
76
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Other names
HD64F2170VTE33
HD64F2170VTE33

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2170VTE33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Bits A31 to A24 do not affect the operation.
Bits A23 to A21 are decoded by the chip select signals (CS3 to CS0) for each area and output.
Bit A20 is not output externally.
Bits A19 to A0 are output externally.
Enabling or disabling external output of bits A19 to A0 can be selected by the setting of PFCR1.
For details, refer to section 8.11.1, Port Function Control Register 1 (PFCR1).
Table 6.2 and figure 6.7 show the address map.
Table 6.2
Note:
Rev. 2.00, 03/04, page 104 of 534
Address
H'000000 to
H'1FFFFF
H'200000 to
H'3FFFFF
H'400000 to
H'DFFFFF
H'E00000 to
H'FFFFFF
*
On-chip RAM space when the RAME bit in SYSCR is 1.
Address Map
Space Type
CS0 space/
on-chip ROM space
CS1 space
CS2 space/
DRAM space
CS3 space/
on-chip RAM space*/
I/O space
Memory Type
External space/
on-chip ROM
External space
External space/
DRAM
External space/
on-chip RAM*/I/O space
Size
2 Mbytes
2 Mbytes
10 Mbytes
2 Mbytes
Bus
Width
8/16
8/16
8/16
8/16

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