DF2170VTE33 Renesas Electronics America, DF2170VTE33 Datasheet - Page 275
![MCU 3V 256K 100-TQFP](/photos/28/61/286108/100-tqfp_sml.jpg)
DF2170VTE33
Manufacturer Part Number
DF2170VTE33
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet
1.DF2170BVTE33V.pdf
(572 pages)
Specifications of DF2170VTE33
Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
SCI, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
76
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Other names
HD64F2170VTE33
HD64F2170VTE33
HD64F2170VTE33
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF2170VTE33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
- Current page: 275 of 572
- Download datasheet (4Mb)
• P51/D1/TEND2
• P50/D0/DREQ2
Note:
EXPE
Bus mode
TENDE
P51DDR
Pin function
EXPE
Bus mode
P50DDR
Pin function
The pin function is switched as shown below according to the combination of the P51DDR bit,
the TENDE bit in DMMDR_2, and the EXPE bit in MDCR.
The pin function is switched as shown below according to the combination of the P50DDR bit,
the DREQS bit in DMMDR_2, and the EXPE bit in MDCR.
*
When DREQS = 1, this pin functions as DREQ2 input.
P51 input
P50 input
0
0
0
0
0
P51 output
P50 output
1
1
P51 input
P50 input
0
All areas are 8-bit space
DREQ2 input*
0
All areas are 8-bit space
0
P51 output
1
P50 output
Rev. 2.00, 03/04, page 241 of 534
1
1
1
TEND2
output
1
At least one area
is 16-bit space
area is 16-bit
At least one
D0 I/O
D1 I/O
space
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