DF2170VTE33 Renesas Electronics America, DF2170VTE33 Datasheet - Page 139

• Manufacturer Part Number: DF2170VTE33
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2170VTE33

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: SCI, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 76
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Data Converters: -
• Other names: HD64F2170VTE33; HD64F2170VTE33

6.4.3
The external address space bus specifications consist of five elements: bus width, number of
access states, number of program wait states, read strobe timing, and chip select (CS) assertion
period extension states. The bus width and number of access states for on-chip memory and
internal I/O registers are fixed, and are not affected by the bus controller.
Bus Width: A bus width of 8 or 16 bits can be selected with ACSCR. An area for which an 8-bit
bus is selected functions as an 8-bit access space, and an area for which a 16-bit bus is selected
functions as a 16-bit access space.
Bus Specifications
H'000000
H'040000
H'200000
H'400000
H'E00000
H'FF7000
H'FFF000
H'FFFC00
H'FFFFFF
Figure 6.7 Address Map
On-chip ROM
On-chip RAM
I/O
Area 0
Area 1
Area 2
Area 3
Rev. 2.00, 03/04, page 105 of 534