DF2170VTE33 Renesas Electronics America, DF2170VTE33 Datasheet - Page 512

• Manufacturer Part Number: DF2170VTE33
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2170VTE33

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: SCI, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 76
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Data Converters: -
• Other names: HD64F2170VTE33; HD64F2170VTE33

16.3
16.3.1
In software standby mode, I/O port states are retained. Therefore, there is no reduction in current
consumption for the output current when a high-level signal is output.
16.3.2
Current consumption increases during the oscillation stabilization standby period.
16.3.3
Relevant interrupt operations cannot be performed in module stop mode. Consequently, if module
stop mode is entered when an interrupt has been requested, it will not be possible to clear the CPU
interrupt source activation source. Interrupts should therefore be disabled before entering module
stop mode.
16.3.4
MSTPCR should only be written to by the CPU.
Rev. 2.00, 03/04, page 478 of 534
Usage Notes
I/O Port Status
Current Consumption during Oscillation Stabilization Standby Period
On-Chip Peripheral Module Interrupts
Writing to MSTPCR