DF2170VTE33 Renesas Electronics America, DF2170VTE33 Datasheet - Page 263

MCU 3V 256K 100-TQFP

DF2170VTE33

Manufacturer Part Number
DF2170VTE33
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet

Specifications of DF2170VTE33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
SCI, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
76
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Other names
HD64F2170VTE33
HD64F2170VTE33

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2170VTE33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
• P21/USD1/TEND0
• P20/USD0/DREQ0
• The pin function is switched as shown below according to the combination of the P20DDR bit,
Note:
USBCKSTP
TENDE
P21DDR
Pin function
USBCKSTP
P20DDR
Pin function
The pin function is switched as shown below according to the combination of the P21DDR bit,
the TENDE bit in DMMDR_0, and the USBCKSTP bit in MSTPCRL.
the DREQS bit in DMMDR_0, and the USBCKSTP bit in MSTPCRL.
*
When DREQS = 1, this pin functions as DREQ0 input.
P21 input
P20 input
0
0
0
P21 output
1
1
1
DREQ0 input*
P20 output
1
TEND0 output
Rev. 2.00, 03/04, page 229 of 534
1
USD0 I/O
USD1 I/O
0
0

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