DF2170VTE33 Renesas Electronics America, DF2170VTE33 Datasheet - Page 350

MCU 3V 256K 100-TQFP

DF2170VTE33

Manufacturer Part Number
DF2170VTE33
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet

Specifications of DF2170VTE33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
SCI, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
76
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Other names
HD64F2170VTE33
HD64F2170VTE33

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2170VTE33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Rev. 2.00, 03/04, page 316 of 534
Read TEND flag in SSR
<Start of transmission>
Transition to software
Figure 11.9 Sample Flowchart for Mode Transition during Transmission
Exit from software
operating mode?
<Transmission>
standby mode
standby mode
Yes
Yes
Yes
transmitted?
Initialization
TEND = 1
Change
All data
TE = 0
No
No
No
[1]
[2]
[3]
TE = 1
[1] Data being transmitted is interrupted.
[2] If TIE and TEIE are set to 1, clear
[3] Includes module stop mode.
After exiting software standby mode,
normal CPU transmission is possible
by setting TE to 1, reading SSR, writ-
ing TDR, and clearing TDRE to 0.
them to 0 in the same way.

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