DF2170VTE33 Renesas Electronics America, DF2170VTE33 Datasheet - Page 48

• Manufacturer Part Number: DF2170VTE33
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2170VTE33

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: SCI, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 76
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Data Converters: -
• Other names: HD64F2170VTE33; HD64F2170VTE33

• Two CPU operating modes
Note: For this LSI, normal mode is not available.
• Power-down state
2.1.1
The differences between the H8S/2600 CPU and the H8S/2000 CPU are as shown below.
• Register configuration
• Basic instructions
• The number of execution states of the MULXU and MULXS instructions
In addition, there are differences in address space, CCR and EXR register functions, power-down
modes, etc., depending on the model.
Rev. 2.00, 03/04, page 14 of 534
Instruction
MULXU
MULXS
Normal mode*
Advanced mode
Transition to power-down state by SLEEP instruction
The MAC register is supported only by the H8S/2600 CPU.
The four instructions MAC, CLRMAC, LDMAC, and STMAC are supported only by the
H8S/2600 CPU.
Differences between H8S/2600 CPU and H8S/2000 CPU
Mnemonic
MULXU.B Rs, Rd
MULXU.W Rs, ERd
MULXS.B Rs, Rd
MULXS.W Rs, ERd
H8S/2600
3
4
4
5
Execution States
H8S/2000
12
20
13
21