DF2170VTE33 Renesas Electronics America, DF2170VTE33 Datasheet - Page 176

MCU 3V 256K 100-TQFP

DF2170VTE33

Manufacturer Part Number
DF2170VTE33
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet

Specifications of DF2170VTE33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
SCI, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
76
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Other names
HD64F2170VTE33
HD64F2170VTE33

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2170VTE33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
6.7
6.7.1
When this LSI accesses external address space, it can insert an idle cycle (T
in the following three cases: (1) when read accesses in different areas occur consecutively or when
an external access cycle occurs after a single address transfer, (2) when (1) occurs and a write
cycle occurs immediately after a read cycle, and (3) when (1) and (2) occur and a read cycle
occurs immediately after a write cycle. A condition for idle cycle insertion can be selected with
the IDLE1 and IDLE0 bits in BCR. The number of idle cycles to be inserted can be set from one
to four states by setting the IDLC1 and IDLC0 bits in BCR. By inserting an idle cycle it is
possible, for example, to avoid data collisions between ROM, etc., with a long output floating
time, and high-speed memory, I/O interfaces, and so on.
Rev. 2.00, 03/04, page 142 of 534
Read
Write
Figure 6.43 Example of DACK Output Timing when DDS = 0 (RAST = 0, CAST = 1)
Idle Cycle
Operation
φ
Address bus
Data bus
Data bus
(
(
(
(
(
,
)
)
)
)
)
T
p
Row address
High
High
T
r
T
c1
Column address
T
c2
i
) between bus cycles
T
c3

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