DF2170VTE33 Renesas Electronics America, DF2170VTE33 Datasheet - Page 458

• Manufacturer Part Number: DF2170VTE33
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2170VTE33

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: SCI, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 76
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Data Converters: -
• Other names: HD64F2170VTE33; HD64F2170VTE33

Table 14.9 (3)
Rev. 2.00, 03/04, page 424 of 534
Item
Storage Area for
Program Data
Operation for
Selection of On-chip
Program to be
Downloaded
Operation for Writing
H'A5 to FKEY
Execution of Writing
SC0 = 1 to FCCS
(Download)
Operation for FKEY
Clear
Determination of
Download Result
Operation for
Download Error
Operation for
Settings of Initial
Parameter
Execution of
Initialization
Determination of
Initialization Result
Operation for
Initialization Error
NMI Handling
Routine
Operation for
Interrupt Inhibit
Switching MATs by
FMATS
Operation for Writing
H'5A to FKEY
Useable Area for Programming in User Boot Mode
On-chip
RAM
Storable/Executable Area
User Boot
MAT
×*
×
×
×
×
×
1
External Space
(Expanded
Mode)
×
×
×
User
MAT

User
Boot
MAT
Selected MAT

Embedded
Program
Storage Area
