DF2170VTE33 Renesas Electronics America, DF2170VTE33 Datasheet - Page 361

MCU 3V 256K 100-TQFP

DF2170VTE33

Manufacturer Part Number
DF2170VTE33
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet

Specifications of DF2170VTE33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
SCI, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
76
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Other names
HD64F2170VTE33
HD64F2170VTE33

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2170VTE33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Notes: 1. FIFO Full
Bit
0
2. FIFO Empty
Bit Name
EP0iTS
In case of IN FIFO:
In case of OUT FIFO:
In case of IN FIFO:
In case of OUT FIFO:
Initial
Value
0
R/W
R/W
The data which can be transmitted is in the FIFO.
The data which is valid is in the FIFO.
The data which can be transmitted is not in the FIFO.
The data which is valid is not in the FIFO.
Description
EP0i Transmit Complete
[Setting condition]
This bit is set to 1 if the data written in EP0i is
transmitted to the host normally and the ACK
handshake is returned.
[Clearing conditions]
At a reset
When 0 is written to this bit
Rev. 2.00, 03/04, page 327 of 534

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