DF2170VTE33 Renesas Electronics America, DF2170VTE33 Datasheet - Page 231

• Manufacturer Part Number: DF2170VTE33
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2170VTE33

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: SCI, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 76
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Data Converters: -
• Other names: HD64F2170VTE33; HD64F2170VTE33

Figure 7.26 shows an example of transfer when TEND output is enabled, and longword-size,
single address mode transfer (read) is performed from external 16-bit, 2-state access space to an
external device.
Single Address Mode (Write): Figure 7.27 shows an example of transfer when TEND output is
enabled, and byte-size, single address mode transfer (write) is performed from an external device
to external 8-bit, 2-state access space.
Figure 7.28 shows an example of transfer when TEND output is enabled, and word-size, single
address mode transfer (write) is performed from an external device to external 8-bit, 2-state access
space.
Address bus
φ
Address bus
Figure 7.26 Example of Single Address Mode (Longword Read) Transfer
φ
Figure 7.27 Example of Single Address Mode (Byte Write) Transfer
release
Bus release
Bus
DMA write
DMA read
Bus release
release
DMA write
Bus
Bus release
DMA read
DMA write
Bus release
Rev. 2.00, 03/04, page 197 of 534
release
Bus
DMA write
transfer
Last transfer cycle
cycle
Last
DMA read
Bus release
release
Bus