DF2170VTE33 Renesas Electronics America, DF2170VTE33 Datasheet - Page 510

• Manufacturer Part Number: DF2170VTE33
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2170VTE33

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: SCI, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 76
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Data Converters: -
• Other names: HD64F2170VTE33; HD64F2170VTE33

16.2.3
Transition to Hardware Standby Mode: When the STBY pin is driven low, a transition is made
to hardware standby mode from any mode.
In hardware standby mode, all functions enter the reset state and stop operation, resulting in a
significant reduction in power consumption. As long as the prescribed voltage is supplied, on-chip
RAM data is retained. I/O ports are set to the high-impedance state.
In order to retain on-chip RAM data, the RAME bit in SYSCR should be cleared to 0 before
driving the STBY pin low. Do not change the state of the mode pins (MD2, MD1) while this LSI
is in hardware standby mode.
Rev. 2.00, 03/04, page 476 of 534
Oscillator
φ
NMI
NMIEG
SSBY
Hardware Standby Mode
Figure 16.2 Software Standby Mode Application Example
NMI exception
handling
NMIEG=1
SSBY=1
SLEEP instruction
Software standby mode
(power-down mode)
stabilization
Oscillation
time t
OSC2
NMI exception
handling