DF2170VTE33 Renesas Electronics America, DF2170VTE33 Datasheet - Page 521

• Manufacturer Part Number: DF2170VTE33
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2170VTE33

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: SCI, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 76
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Data Converters: -
• Other names: HD64F2170VTE33; HD64F2170VTE33

Register
Abbreviation
FCLR0
EPSTL0
DMA0
CTRL
SBYCR
MSTPCRH
MSTPCRL
SYSCR
MDCR
USBSUSP
ACSCR
CSACR
WTCR
BCR
RDNCR
RAMER
DRAMCR
DRACCR
Bit 7
















SSBY

SCICKSTP

EXPE
USUSMONI
ABW3
CSXH3 CSXH2 CSXH1 CSXH0 CSXT3 CSXT2 CSXT1 CSXT0




RDN3


BE

Bit 6



EP3CLR EP2CLR EP1CLR












STS2




USUSFG
ABW2
W32
W12


RDN2

RAST
RCDM

Bit 5















STS1


INTM1

USUSFGE USUSOUT
ABW1
W31
W11


RDN1


DDS
TPC1
Bit 4















STS0
TMRCKSTP
USBCKSTP
INTM0

ABW0
W30
W10



CAST

TPC0
RDN0
Bit 3







EP3STL EP2STL EP1STL EP0STL











XRST


AST3



IDLE1

RAMS



Bit 2


















NMIEG 
MDS2

AST2
W22
W02

IDLE0

RAM2

MXC2

Rev. 2.00, 03/04, page 487 of 534
Bit 1



EP0oCLR






EP2DMAE EP1DMAE



ASCE



MDS1

AST1
W21
W01

IDLC1

RAM1

MXC1
RCD1
Bit 0



EP0iCLR









PULLUPE



RAME
MDS0

AST0
W20
W00
WDBE
IDLC0

RAM0
DSET
MXC0
RCD0
Module
USB2
SYSTEM
USB2
BSC
FLASH
BSC