DF2170VTE33 Renesas Electronics America, DF2170VTE33 Datasheet - Page 232

• Manufacturer Part Number: DF2170VTE33
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2170VTE33

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: SCI, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 76
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Data Converters: -
• Other names: HD64F2170VTE33; HD64F2170VTE33

After one byte or word has been transferred in response to one transfer request, the bus is released.
While the bus is released, one or more CPU bus cycles are initiated.
Figure 7.29 shows an example of transfer when TEND output is enabled, and longword-size,
single address mode transfer (write) is performed from an external device to external 16-bit, 2-
state access space.
Rev. 2.00, 03/04, page 198 of 534
Address bus
φ
Address bus
Bus release
Figure 7.29 Example of Single Address Mode (Longword Write) Transfer
φ
Figure 7.28 Example of Single Address Mode (Word Write) Transfer
release
Bus
DMA write
DMA write
Bus release
release
Bus
DMA write
DMA write
Bus release
release
Bus
Last transfer cycle
Last transfer cycle
DMA write
DMA write
Bus
release
release
Bus