hi-6131pqtf QuickLogic Corp, hi-6131pqtf Datasheet - Page 270

• Manufacturer Part Number: hi-6131pqtf
• Description: Mil-std-1553 / Mil-std-1760 3.3v Bc / Mt / Rt Multi-terminal Device
• Manufacturer: QuickLogic Corp

32. PACKAGE DIMENSIONS
(9.00)
.354
HI-6131: 64-PIN PLASTIC CHIP-SCALE PACKAGE (QFN)
(1.00)
.039
HI-6130: 100-PIN PLASTIC QUAD FLAT PACK (PQFP)
(1.50 ± .10)
.059 .004
BSC
max
(16.0)
.630
±
BSC SQ
(9.00)
Top View
.354
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
BSC
(1.0)
.039
typ
Heat sink must be left floating or connected to V
HOLT INTEGRATED CIRCUITS
See Detail A
HI-6130, HI-6131
Heat sink pad on bottom of package.
(0.20)
.008
DO NOT connect to GND.
typ
(14.0)
270
.551
(7.15
.281 ± .006
BSC SQ
(1.40 ± .05)
± .15
.055
(0.40
.016 ± .004
±
)
.002
± .10
(0.20)
.008
(0.08)
.003
)
DD
.
min
(7.15
.281 ± .006
R min
Bottom
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
View
± .15
)
inches (millimeters)
Package Type: 100PQS
(0.50)
.024
.0197
(.60 ± .15)
Detail A
.009 .002
(.22 ± .05)
inches (millimeters)
Package Type: 64PCS
±
(0.20)
.008
±
BSC
.006
R max
(0.50)
(0.25)
.0197
.010
0°
typ
BSC
7°